Description

Role and responsibilities
Passivation
Etching process
Aluminum, Titanium etching process
Sulphuri anodizing
Chromic anodizing
Handling of deffence components and raffale components 
Chemical analysis, brass pickling 
Lab 
Quality

Role and responsibilities
Identification Of Required Materials and Chemicals
Types of platings

Sulfuric Anodizing (20 -30 Microns)
Hard Anodizing (40-100 Microns)
Chromic Anodizing (.5-3 Microns)
Chemical nickel
hard chrome 
passivations (ss, copper,alodine)
phosphating
electrolytic nickel

ANALYSIS OF FOLLOWING PLATING AND CHEMICAL SOLUTIONS BY VOLUMETRIC TITRATION.

CHEMICAL Ni PLATING
nickel content,reducer content,temperature,strike preparation
zincating preparation
Chemicals:artek 512A,B,C&510A,B,C
METAL:aluminium,iron

ELECTROLYTIC NICKEL
nickel content,boric acid content,ph,temp ect
Chemicals: nickel chloride,boric acid,nickel sulphate,brightner 
METAL:aluminium,iron

HARD CHROME
chromic acid content, sulphate content
Chemicals:H E N E salt, additives1&2(growell)
METAL:,iron

PHOSPHATING
acid pointage 
Chemicals:phospholube (metal guard) 
METAL:,iron

ANODIZING(type 2)
sulphuric acid content , Alcontent 
METAL:aluminium

ANODIZING(type 1)
chromic acid content , al content
METAL:aluminium

ANODIZING(type3)
sulphuric acid content,al conyent, 
METAL:aluminium,